Chen Kuan-Neng

社会実装研究

Chen Kuan-Neng

特任教授

semiconductorselectronic materialselectrical engineering

研究プロジェクト

  • 3D IC、Heterogeneous Integration、Advanced Packaging、Wafer Bonding、TSV

トピックス

2000 - 2005

Ph.D., Dept. EECS, MIT

2005 - 2009

Research Staff Member, IBM TJ Watson Research Center

2009 - 2012

Associate Professor, Dept. Electronics Engineering, NCTU

2012 -

Professor, Dept. Electronics Engineering, NCTU

2015 -

Vice Dean, Intl College of Semiconductor Technology, NCTU

2016 -

R&D Director, ITRI

2017-

Specially Appointed Professor, Tokyo Institute of Technology

2018-

Micron Chair Professor

2018-

Distinguished Professor, NCTU

2019-

Vice President, International Affairs, NCTU

2010

Outstanding Youth Award, Electronics Devices and Materials Association (EDMA), 2010

Young Professor Award, Adventech, 2010

2011

NCTU Distinguished Faculty Award, since 2011 every year

NCTU Outstanding Industry-Academia Cooperation Achievement Award

2012

Outstanding Youth Award, Chinese Institute of Electrical Engineering (CIEE)

NCTU Outstanding Industry-Academia Cooperation Achievement Award

2014

Outstanding Professor Award, Chinese Institute of Electrical Engineering (CIEE), 2014

Outstanding Service Award, Electronics Devices and Materials Association (EDMA), 2014

NCTU Outstanding Industry-Academia Cooperation Achievement Award

2018

IEEE Fellow, 2018
“for contributions to 3D integrated circuit and packaging technologies”

2018

IEEE EPS Exceptional Technical Achievement Award, IEEE Electronics Packaging Society, 2018.

“For contributions to 2.5D and 3D IC heterogeneous integration, with focus on interconnect technologies.”
2018

MOST Outstanding Research Award, Ministry of Science and Technology, 2018.

2013

“Through-Silicon-Via Based Double-Side Integrated Microsystem for Neural Sensing Applications”, ISSCC, 2013..

2014

“2.5D Heterogeneously Integrated Bio-Sensing Microsystem for Multi-Channel Neural Sensing Applications,” ISSCC,

2016

“An Advanced 3D/2.5D Integration Packaging Approach Using Double-Self-Assembly Method with Complex Topography, and Micropin-Fin Heat Sink Interposer for Pressure Sensing System”, IEDM, 2016

“Integration of Neural Sensing Microsystem with TSV-embedded Dissolvable µ-Needles Array, Biocompatible Flexible Interposer, and Neural Recording Circuits”, VLSI, 2016.

2018

“Location-controlled-grain Technique for Monolithic 3D BEOL FinFET Circuits”, IEDM, 2018.