【論文】Highly Reliable Four-Point Bending Test Using Stealth Dicing Method for Adhesion Evaluation

【論文】Highly Reliable Four-Point Bending Test Using Stealth Dicing Method for Adhesion Evaluation

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異種機能集積研究ユニット 大場隆之教授とKuan-Neng Chen特任教授の共著論文が2019 International Conference on Electronics Packaging (ICEP) に掲載されました。

Authors:

Yi-Lun Yang, Jia-Ling Liu, Guan Wei Chen, Shoichi Kodama, Kyosuke Kobinata, Kuan-Neng Chen, Hiroyuki Ito, Young Suk Kim, Takayuki Ohba

DOI:10.23919/ICEP.2019.8733422