2000-2005 Ph.D., Dept. EECS, MIT
2005-2009 Research Staff Member, IBM TJ Watson Research Center
2009-2012 Associate Professor, Dept. Electronics Engineering, NCTU
2012- Professor, Dept. Electronics Engineering, NCTU
2015- Vice Dean, Intl College of Semiconductor Technology, NCTU
2016- R&D Director, ITRI
Field of Specialization
semiconductors，electronic materials，electrical engineering
Laboratory for Future Interdisciplinary Research of science and Technology（IIR, Tokyo Tech）
National Chiao Tung University (Taiwan)
3D IC、Heterogeneous Integration、Advanced Packaging、Wafer Bonding、TSV
- Press Conference, “交大研發第五代高階電子封裝技術 低溫(150oC)及低壓下之銅-銅直接接合”, June 3, 2015.(http://www.appledaily.com.tw/realtimenews/article/new/20150603/621876/ )(http://www.chinatimes.com/realtimenews/20150603002959-260412)(http://nctunews.nctu.edu.tw/index.php/component/k2/item/913-150-oc)
- UST Scientific Knowledge Column, Taiwan News, “Moore, More and Much More”, July 9, 2013. (http://www.taiwannews.com.tw/etn/news_content.php?id=22530840
- NCTU Distinguished Faculty Award, since 2011 every year
- NCTU Outstanding Industry-Academia Cooperation Achievement Award, 2011, 2012, 2014
- Outstanding Professor Award, Chinese Institute of Electrical Engineering (CIEE), 2014
- Outstanding Service Award, Electronics Devices and Materials Association (EDMA), 2014
- Outstanding Youth Award, Chinese Institute of Electrical Engineering (CIEE), 2012
- Outstanding Youth Award, Electronics Devices and Materials Association (EDMA), 2010
- Young Professor Award, Adventech, 2010
“An Advanced 3D/2.5D Integration Packaging Approach Using Double-Self-Assembly Method with Complex Topography, and Micropin-Fin Heat Sink Interposer for Pressure Sensing System”, IEDM, 2016
“Integration of Neural Sensing Microsystem with TSV-embedded Dissolvable µ-Needles Array, Biocompatible Flexible Interposer, and Neural Recording Circuits”, VLSI, 2016.
“2.5D Heterogeneously Integrated Bio-Sensing Microsystem for Multi-Channel Neural Sensing Applications,” ISSCC, 2014.
“Through-Silicon-Via Based Double-Side Integrated Microsystem for Neural Sensing Applications”, ISSCC, 2013..